Our truly flexible transistor technology platform
FlexEnable has pioneered and industrialised a groundbreaking organic transistor technology platform that is capable of driving the next big trends in consumer electronics.
Our unique technology allows electronics to be manufactured on flexible plastic film, the thickness of a sheet of paper. It combines stable, high performance organic thin-film transistors (OTFT) with passive elements to create truly flexible and cost-effective electronics over large and small surfaces. This has led to the successful volume production of thin, lightweight and robust backplanes for flexible displays and sensors.
FlexEnable’s platform is the most significant new transistor technology in decades that can be commercialised at scale. Our flexible backplane has versatile applications for a variety of frontplanes including OLCD and OLED displays, X-ray image sensors, fingerprint sensors, pressure sensors, and smart systems. It enables new product paradigms in a wide range of industries including mobile, wearables, automotive, aerospace, biometrics and healthcare.
Example of integrating our flexible backplane (transistor array) with a frontplane (sensor or display technology)
Key benefits of FlexEnable's OTFT backplane technology
Our proven OTFT platform is the most flexible array technology available and offers unique benefits including:
- Bending radius down to 0.25 mm
- Substrate thickness down to 25 µm
- As light as a sheet of paper
- Better electrical performance than conventional a-Si glass-based TFT technology
- High manufacturing yield compared to polyimide-based processes
- Lowest total cost of ownership for flexible displays and sensor arrays
Manufacturing advantages of FlexEnable's OTFT backplane technology
There are many challenges to manufacturing high resolution, fine feature electronics onto large area flexible sheets, all of which been overcome by our low temperature process technology for truly flexible electronics. A maximum processing temperature below 100°C allows for the use of lower cost plastic substrates (e.g. PET), minimising distortion (to improve yield) and enabling low cost, high yield mount and demount approach to handling flexible substrates.
Our low-temperature solution process enables the manufacture of organic transistors with the same mobility as conventional, anorganic materials
Mount and demount process
FlexEnable’s efficient manufacturing approach to making flexible electronics is unique. The conventional approach is to manufacture silicon or other ceramic-based circuits on glass with a highly engineered interlayer that is capable of coping with the extreme process temperatures, often surpassing 450°C, required for these transistor technologies. The removal of this circuit from the glass requires stressful and often expensive debonding techniques that are difficult to automate and yield poorly.
Our approach is to use conventional adhesive technology to attach low cost plastic films to glass and then use our low temperature organic transistor process to manufacture the same circuits. This allows us to use a very simple and efficient demount process to release the flexible device and recycle the glass carrier. In summary, we developed a bottom-up approach for making flexible electronics using fundamentally flexible plastic materials at low temperatures instead of shoehorning conventional electronics onto plastic.
FlexEnable's low cost mount and demount process compared with conventional 'lift off' approaches
Read about how you can incorporate our enabling technology in your products through our Partnering models.