FlexiOM™ Materials

A complete range of materials for OTFT backplanes

With FlexiOM™, we offer a complete range of materials for organic thin film transistor (OTFT) backplanes. These inherently flexible materials enable the manufacture of ultra-thin, lightweight, and conformable optics and displays. OTFT backplanes, featuring FlexEnable’s organic polymer semiconductors and dielectric materials, are now in mass production for ePaper displays and shipping in consumer products.

FlexiOM OTFTs can be uniqely processed at temperatures lower than 100°C allowing for the use of lower cost biodegradable plastic substrates. Moreover, these materials can be processed using standard techniques and equipment used in today’s existing FPD production lines. In contrast, inorganic TFTs require processing involving large amounts of energy, gases, chemicals and waste water. In the future, FlexiOM materials could be deposited using printing techniques for significantly enhanced production efficiency.

FlexiOM materials natural flexibility and suitability for plastic substrates drives new features in display and liquid crystal optics applications including lightweight, robust, bendable, conformable and fully flexible devices.

Key features & benefits

Inherent flexibility – truly flexible TFTs to sub-mm bend radius
Better mobility than amorphous silicon
Long operating lifetimes and very high uniformity for large area manufacturing
A low-temperature solution-based OTFT manufacturing process (<100°C)
Excellent solubility in common manufacturing solvents
Enable manufacture on lower cost substrates compared to LTPS or oxide, which still require expensive polyimide

Can be integrated with frontplanes such as LCD and EPD
Enable display makers to rapidly repurpose existing LCD lines with minimal investment
Enable flexible TFT sheet-fed production using traditional mask-based microfabrication techniques
Can be scaled-up to any Gen size production line
More sustainable than existing silicon based TFTs due to lower temperature process

FlexiOM™ materials portfolio

Our FlexiOM™ materials portfolio includes the world’s highest-performance organic semiconductors and dielectrics. These materials form the core of the OTFT backplane for flexible displays and liquid crystal optics. They are available as ready-optimised formulations for use in existing flat panel display factories. FE-D048X, FE-D320 and FE-S500 are also offered as a package so our customers can derive the maximum value.

FlexiOM D048X

FlexiOM D048X is a crosslinkable organic dielectric formulation optimised for coating on top of FlexiOM D320 organic dielectric in top-gate field effect transistors.
Dielectric constant ~2.5
Breakdown Strength >1MV/cm
Formulated for spin-coat deposition processes
Cross-linked using standard i-line UV exposure
Excellent electrical/operational stability when combined with FlexiOM S500 organic semiconductor and FlexiOM D320 1st layer dielectric

FlexiOM D320

FlexiOM D320 is an organic dielectric formulation optimised for deposition on top of the FlexiOM S500 in top-gate organic field effect transistors
Low dielectric constant, ~2, for optimal electronic interface with FlexiOM S500
Breakdown Strength >1MV/cm
Formulated for spin-coat deposition processes
Excellent electrical/operational stability when combined with FlexiOM S500 organic semiconductor and FlexiOM D048X 2nd layer dielectric

FlexiOM S500

FlexiOM S500 is a p-type organic semiconductor for application in top-gate, organic thin film transistors
Mobility >1.5cm2/Vs, which is larger than Amorphous Silicon
Can be formulated for spin-coat or slot-die deposition processes
Excellent electrical/operational stability when combined with FlexiOM D320 and FlexiOM D049X dielectrics
Novel formulations available on request

FlexiOM P100

FlexiOM P100 is an organic dielectric formulation for application as a planarisation layer on TAC substrates in Liquid Crystal Optical Cell structures
Formulated in PGMEA solvent with a tuneable viscosity between ~4cPs and ~30cPs
Crosslinked using standard i-line UV exposure
Dielectric Constant ~4.5
Breakdown strength >1MV/cm
Glass transition temperature ~130°C
Transmittance >90%
Haze, 0.25
Birefringence 14 cd/m2

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