FlexiOM™

The world’s highest-performance OTFT materials for flexible displays, liquid crystal optics and large-area flexible electronics

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A complete range of materials for OTFT backplanes

With FlexiOM™, we offer a complete range of materials for organic thin film transistor (OTFT) backplanes. These materials can considerably simplify the production of Liquid Crystal Displays (LCDs) and other display types such as Electrophoretic Displays (EPD).

FlexiOM OTFTs can be processed at temperatures lower than 100°C allowing for the use of lower cost biodegradable plastic substrates. Moreover, these materials can be processed using standard techniques and equipment used in today’s existing LCD production lines. In contrast, inorganic TFTs require processing involving large amounts of energy, gases, chemicals and waste water. In the future, FlexiOM materials could be deposited using printing techniques for significantly enhanced production efficiency.

FlexiOM materials natural flexibility and suitability for plastic substrates drives new features in display and liquid crystal optics applications including lightweight, robust, bendable, conformable and fully flexible devices.

Key features & benefits

  • Inherent flexibility – truly flexible TFTs to sub-mm bend radius
  • Better mobility than amorphous silicon
  • Long operating lifetimes and very high uniformity for large area manufacturing
  • A low-temperature solution-based OTFT manufacturing process (<100°C)
  • Excellent solubility in common manufacturing solvents
  • Enable manufacture on lower cost substrates compared to LTPS or oxide, which still require expensive polyimide
  • Can be integrated with frontplanes such as LCD and EPD
  • Enable display makers to rapidly repurpose existing LCD lines with minimal investment
  • Enable flexible TFT sheet-fed production using traditional mask-based microfabrication techniques
  • Can be scaled-up to any Gen size production line
  • More sustainable than existing silicon based TFTs due to lower temperature process

FlexiOM™ materials portfolio

Our FlexiOM™ materials portfolio includes the world’s highest-performance organic semiconductors and dielectrics. These materials form the core of the OTFT backplane for flexible displays and liquid crystal optics. They are available as ready-optimised formulations for use in existing flat panel display factories. FE-D048X, FE-D320 and FE-S500 are also offered as a package so our customers can derive the maximum value.

FlexiOM D048X

  • FlexiOM D048X is a crosslinkable organic dielectric formulation optimised for coating on top of FlexiOM D320 organic dielectric in top-gate field effect transistors.
  • Dielectric constant ~2.5
  • Breakdown Strength >1MV/cm
  • Formulated for spin-coat deposition processes
  • Cross-linked using standard i-line UV exposure
  • Excellent electrical/operational stability when combined with FlexiOM S500 organic semiconductor and FlexiOM D320 1st layer dielectric

FlexiOM D320

  • FlexiOM D320 is an organic dielectric formulation optimised for deposition on top of the FlexiOM S500 in top-gate organic field effect transistors
  • Low dielectric constant, ~2, for optimal electronic interface with FlexiOM S500
  • Breakdown Strength >1MV/cm
  • Formulated for spin-coat deposition processes
  • Excellent electrical/operational stability when combined with FlexiOM S500 organic semiconductor and FlexiOM D048X 2nd layer dielectric

FlexiOM S500

  • FlexiOM S500 is a p-type organic semiconductor for application in top-gate, organic thin film transistors
  • Mobility >1.5cm2/Vs, which is larger than Amorphous Silicon
  • Can be formulated for spin-coat or slot-die deposition processes
  • Excellent electrical/operational stability when combined with FlexiOM D320 and FlexiOM D049X dielectrics
  • Novel formulations available on request

FlexiOM P100

  • FlexiOM P100 is an organic dielectric formulation for application as a planarisation layer on TAC substrates in Liquid Crystal Optical Cell structures
  • Formulated in PGMEA solvent with a tuneable viscosity between ~4cPs and ~30cPs
  • Crosslinked using standard i-line UV exposure
  • Dielectric Constant ~4.5
  • Breakdown strength >1MV/cm
  • Glass transition temperature ~130°C
  • Transmittance >90%
  • Haze, 0.25
  • Birefringence 14 cd/m2