Our truly flexible transistor technology platform

FlexEnable has developed an industrially-proven organic transistor technology platform for flexible displays and sensors.

Our unique technology allows electronics to be manufactured on flexible plastic film which is as thin as a sheet of paper. It combines stable, high performance organic thin-film transistors (OTFT) with passive elements to create truly flexible and cost-effective electronics over large and small surfaces. This has led to the successful volume production of thin, lightweight and robust backplanes for flexible displays and sensors. 

FlexEnable’s award-winning OTFT platform is the most significant new transistor technology in decades. Our flexible backplane has versatile applications for a variety of technologies including OLCDOLED displays, X-ray image sensors and fingerprint sensors. It enables new product paradigms in a wide range of industries including automotive, digital signage, consumer electronics, security and healthcare.

 

Image of a frontplane and backplane being integrated

Example of integrating our flexible backplane (transistor array) with a frontplane (sensor or display technology)

Key benefits of FlexEnable's OTFT backplane technology

Our proven OTFT platform is the most flexible array technology available and offers unique benefits.

flexible orange ultrathin orange ultralight orange Long lifetime
Ultra flexible

Bending radius down to 0.25 mm

Ultra thin

Substrate thickness down to 25 µm

Ultra light

6g per A4 sheet

Long lifetime

Better stability than a-Si

lowtemperature orange  Better mobility than a-Si  Low leakage lowcost orange
Low temperature

<100°C

High mobility

Better mobility than a-Si 

Low leakage

Lower leakage currents than a-Si

Low cost

Lowest total cost of ownership for all areas

 

Manufacturing advantages of FlexEnable's OTFT backplane technology 

There are many challenges to manufacturing high resolution, fine feature electronics onto large area flexible sheets, all of which been overcome by our low temperature process technology for truly flexible electronics. A maximum processing temperature below 100°C allows for the use of lower cost plastic substrates like triacetyl cellulose (TAC), minimising distortion (to improve yield) and enabling low cost, high yield mount and demount approach to handling flexible substrates.

graph showing low temp solution process and high temp solution process

Our low-temperature solution process enables the manufacture of organic transistors with the same mobility as conventional, inorganic materials  

Unique liquid crystal cell assembly process on plastic

FlexEnable’s low temperature processing has enabled not only the use of commonly available flexible substrates like TAC and polycarbonate, but has also led to the development of a unique low temperature liquid crystal cell assembly process on plastic. The result is a very thin frontplane technology that can be used to make active matrix plastic LCDs or any other liquid crystal optics components.

Mount and demount process

FlexEnable’s efficient manufacturing approach to making flexible electronics is unique. The conventional approach is to manufacture silicon or other ceramic-based circuits on glass with a highly engineered interlayer that is capable of coping with the extreme process temperatures, often surpassing 450°C, required for these transistor technologies. The removal of this circuit from the glass requires stressful and often expensive debonding techniques that are difficult to automate and yield poorly. 

Our approach is to use conventional adhesive technology to attach low cost plastic films to glass and then use our low temperature organic transistor process to manufacture the same circuits. This allows us to use a very simple and efficient demount process to release the flexible device and recycle the glass carrier.  In summary, we developed a bottom-up approach for making flexible electronics using fundamentally flexible plastic materials at low temperatures instead of shoehorning conventional electronics onto plastic.



different icons showing the processes

FlexEnable's low cost mount and demount process compared with conventional 'lift off' approaches

Read about how you can incorporate our enabling technology in your products through our Partnering models.