OTFT technology platform
FlexEnable has developed an industrially-proven organic transistor technology platform for flexible displays and sensors.
FlexEnable’s award-winning organic thin-film transistors (OTFT) technology platform is the most significant new transistor technology in decades. It allows electronics to be manufactured on flexible film which is as thin as a sheet of paper. It combines stable, high-performance OTFTs with passive elements to create truly flexible and cost-effective electronics over large and small surfaces. FlexEnable also owns the best-in-class OTFT materials related to its technology – FlexiOM™ materials.
Applications for this technology include flexible organic LCDs (OLCDs) for consumer electronics and automotive applications, flexible sensor arrays and other OTFT devices.
Example of integrating our flexible backplane (transistor array) with a frontplane (sensor or display technology)
Key benefits of FlexEnable's OTFT backplane technology
Our proven OTFT platform is the most flexible array technology available and offers unique benefits.
Bending radius down to 0.25 mm
Substrate thickness down to 25 µm
6g per A4 sheet
Better stability than a-Si
Better mobility than a-Si
Lower leakage currents than a-Si
Lowest total cost of ownership for all areas
Manufacturing advantages of FlexEnable's OTFT backplane technology
There are many challenges to manufacturing high resolution, fine feature electronics onto large area flexible sheets, all of which been overcome by our low temperature process technology for truly flexible electronics. A maximum processing temperature below 100°C allows for the use of lower cost substrates like triacetyl cellulose (TAC), minimising distortion (to improve yield) and enabling low cost, high yield mount and demount approach to handling flexible substrates.
Our low-temperature solution process enables the manufacture of organic transistors with the same mobility as conventional, inorganic materials
Unique liquid crystal cell assembly process on plastic
FlexEnable’s low temperature processing has enabled not only the use of commonly available flexible substrates like TAC and polycarbonate, but has also led to the development of a unique low temperature liquid crystal cell assembly process on plastic. The result is a very thin frontplane technology that can be used to make active matrix flexible OLCDs or any other liquid crystal optics components.
Mount and demount process
FlexEnable’s efficient manufacturing approach to making flexible electronics is unique. The conventional approach is to manufacture silicon or other ceramic-based circuits on glass with a highly engineered interlayer that is capable of coping with the extreme process temperatures, often surpassing 450°C, required for these transistor technologies. The removal of this circuit from the glass requires stressful and often expensive debonding techniques that are difficult to automate and yield poorly.
Our approach is to use conventional adhesive technology to attach low cost plastic films to glass and then use our low temperature organic transistor process to manufacture the same circuits. This allows us to use a very simple and efficient demount process to release the flexible device and recycle the glass carrier. In summary, we developed a bottom-up approach for making flexible electronics using fundamentally flexible materials at low temperatures instead of shoehorning conventional electronics onto plastic.
FlexEnable's low cost mount and demount process compared with conventional 'lift off' approaches